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Scroll to disassemble and experience a new spatial computer chassis engineered with raw silicon.
Built on leading 3-nanometer lithography. The silicon features 40 billion transistors powering neural network compute models and dynamic ray tracing inside visual space.
Features custom dual-channel centrifugal cooling that exhausts warm air silently below the chassis ring. Operating decibels remain lower than ambient office sound levels.
Choose your compute module. Shipments start early Q1 2027 with complimentary secure white-glove courier shipping.
We push modern physics to craft compute chips that are smaller, faster, and operate with maximum efficiency.
32-core NPU executing 42 trillion operations per second. Custom-made for real-time generative modeling and visual classification logic.
Up to 192GB LPDDR5X memory featuring 800GB/s bandwidth. Run high-token language models directly on the client with zero delay.
Hardware-isolated keys store biometric and operational data. Protects models and datasets from boot-level memory intrusion.
Vapor chamber and micro-fins siphon heat directly to the chassis frame. Fan-less quiet design during lightweight computational workloads.
Dual-tier logical stacking connects two dies using high-speed interconnect buses. Scale cores and performance seamlessly.
Thunderbolt 5 support with 120Gbps data transport bandwidth. Connect multiple 8K spatial screens without frame drops.
Configured systems include our high-efficiency liquid-metal thermal block and complimentary custom storage racks.